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BONDPLAS ENGINEERING

LiveUEN 53008004DSole Proprietorship/ Partnership

BONDPLAS ENGINEERING is a sole proprietorship/ partnership in Singapore with UEN 53008004D. It was registered on 13 Nov 2003, 22 years ago. Its status is Live. Its main activity is engineering design and consultancy activities n.e.c..

UEN	53008004D
Status	Live
Entity type	Sole Proprietorship/ Partnership, Partnership
Registered	13 Nov 2003
Main activity (SSIC)	71129 Engineering design and consultancy activities n.e.c.
Address	20 WOODLANDS LINK, #08-16, Singapore 738733 364 companies at this address
Area	Sembawang · District 25 (Kranji, Woodgrove)
Nearest station	Sembawang MRT, about 1007 m
Officers	2

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Source: ACRA open data, data date 16 Sep 2026. Directors, shareholders and financial statements are not in the open data.